| Issue 135 March/April 2005 |
|
Technology transfer
- CrackFirst TM - a new sensor system to assist in structural health monitoring
- The modelling option ... lead-free soldered circuitry faces a reliability onceover
- SkillWELD winner goes West
- Core research pushes the boundaries
- New team for industry support
- News in brief
- A tribute to Trevor
- Upgraded P-scan ultrasonic equipment
Best practice
- Job knowledge No.75: Hardness Testing Part 2
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