In the last 5-10 years there has been a significant increase in activities in electronics and sensor packaging for harsh environments. To address the technology needs in this area, TWI uses cross-disciplinary teams from its Microtechnology, Ceramics, Glass, Films/Coatings Technology, Polymer Resin, FEA Modelling, Non-destructive/Environmental testing and Manufacturing Processes Groups.
This approach enables all the packaging elements to be considered at an early stage, using equipment and solutions from both inside and outside the traditional electronics/sensors technology industries.
Examples of recent projects/activities which are relevant to Harsh Environment Packaging include:
- Optical fibre packaging for harsh environments (high pressure/temperature/chemically active)
- Replacement of soldered interconnects with welded joints
- Development of a low stress, large area die/substrate attach design through FEA/thermal modelling
- Verification of thermal modelling software through IR measurements of power devices
- Evaluation of highly accelerated stress testing for high temperature components
- Development of high thermal conductivity Al2O3 sprayed dielectrics
- Development of Sol-Gel high temperature adhesives
- Development of Sol-Gel moisture resistant coatings
- Joining of SiC with ceramic modified braze alloys
- Modification of braze alloys for ceramic/metal joining to reduce thermal stress
- Development of active braze alloys with hot pressed SiC
- Assessment of high temperature adhesives, resin encapsulants and ceramics for hot water environments