Optoelectronics & displays packaging has been a significant activity at TWI for approximately 25 years. Work in this area has expanded to cover:

• Low heat input/hermetic sealing
• Laser/diode alignment/attachment systems
• Substrate attachment systems
• Interconnection systems
• Development of alignment jigs
• Development of glass attachment systems
• Measurement of fibre attachment adhesive shrinkage during curing
• Assessment of the impact of assembly materials/processes on fibre alignment/stability
  
  
• Flat panel display ruggedisation
• Printable ITO
• ITO replacement
• OLED packaging
  
  
• Troubleshooting opto-packaging production problems

To address work in these areas, TWI brings together its skills and experience in optoelectronics packaging, materials (metals, polymers, ceramics and glass), adhesive/encapsulant systems, surface conditioning, finite element modelling, inspection, NDT, QA/QC and manufacturing systems.