TWI has a broad background in PCB technology, covering, rigid and flexible board materials, Surface Mount (SMT), Through-Hole (TH) and Chip-on-Board (COB) technology.

During the last 10 years emphasis has been given to assist companies making the transition to lead-free soldering. In this respect TWI changed its SMT line to lead-free materials in 2003 to enable companies to test for solderability and potential component/board damage.

Below is a selection of the many PCB projects TWI has undertaken in recent years:

  • Lead-free soldering for the consumer and automotive sectors
  • High temperature soldering of die to leadframes
  • No clean flux selection
  • Low temperature soldering of temperature sensitive devices
  • PCB finish evaluation
  • Development of an in-line PCB inspection system
  • Solder joint failure analysis
  • Surface mount conductive adhesive selection
  • Reflow oven profiling
  • Lasers drilling and cutting PCB's
  • Development of COB technology