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TWI has a broad background in PCB technology, covering, rigid and flexible board materials, Surface Mount (SMT), Through-Hole (TH) and Chip-on-Board (COB) technology.
During the last 10 years emphasis has been given to assist companies making the transition to lead-free soldering. In this respect TWI changed its SMT line to lead-free materials in 2003 to enable companies to test for solderability and potential component/board damage.
Below is a selection of the many PCB projects TWI has undertaken in recent years:
- Lead-free soldering for the consumer and automotive sectors
- High temperature soldering of die to leadframes
- No clean flux selection
- Low temperature soldering of temperature sensitive devices
- PCB finish evaluation
- Development of an in-line PCB inspection system
- Solder joint failure analysis
- Surface mount conductive adhesive selection
- Reflow oven profiling
- Lasers drilling and cutting PCB's
- Development of COB technology
Information and advice from TWI and its partners are provided in good faith and based, where
appropriate, on the best engineering knowledge available at the time and incorporated into TWI's
website in accordance with TWI's ISO 9001:2000 accredited status. No warranty expressed or implied
is given regarding the results or effects of applying information or advice obtained from the
website, nor is any responsibility accepted for any consequential loss or damage.