| Finetech Fineplacer - Flip chip placement & bonding |
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Technology
Flip Chip bonding (FCB) is a method of attaching electronic devices to interconnection boards without the use of wire bonds. Typically, the I/O pads of the device have solder bumps, which are used to connect the chip directly to the board, providing both electrical contact and mechanical attachment. Adhesive based and ultrasonic bonding versions of FCB are also available. FCB is used to increase device packing on the board and improve especially high frequency performance.
Expertise
The Microtechnology Section of TWI has expertise in:
- Thermocompression & thermosonic bonding
- Solder and adhesive flip chip assembly
- Stud bumping
Equipment
- Finetech Picoplacer flip chip bonder
- ±1µm placement accuracy
- Class 10,000 clean room facility
Project Work
Project work has included:
- Prototyping, feasibility studies
- Trouble shooting & failure analysis
- Fatigue, mechanical & non destructive testing
- Tailored & scheduled training courses
- Environmental testing
If you require further information or if you want to discuss your application, please email to micro@twi.co.uk.
| Solder flip chip interconnection | ACF bonded Flip chip |
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