Technology file

Real-time microfocus X-ray inspection

X-ray of solder bridging - reveals hidden defects & faults in small assemblies

X-ray image of solder bridging in ball grid array

Expertise

TWI's Advanced Materials & Processes Department has wide experience of applying real-time microfocus X-ray inspection in the production of small-scale assemblies. Consultancy and project work have involved:

  • soldered & brazed joints, conductive adhesive bonds, fine gold wire bonds
  • determination of joint shape, size, alignment & quality
  • detection of structural defects

For further information, please mail to micro@twi.co.uk.