Technology file

Technology

Soldering is a joining process during which the components to be assembled are wetted by a molten filler metal, whose melting temperature is below 4507°C.

Soldering is used extensively in the assembly of Printed Circuit Board Assembly and of electronic and photonic devices, and also for small mechanical assembly. Traditionally, lead was a constituent of solders, but recent legislations (WEEE and RoHS) have banned the use of lead solders to the benefit of lead-free solders in certain applications.

Expertise

The Microtechnology Section has developed expertise in all aspects of soldering technology, including:

• Solder joint design
• Selection of soldering materials, including alloys and fluxes
• Process set-up and optimisation, including jigging, heating method, atmosphere and thermal profiling for reflow, wave and hand soldering
• Reliability and failure analysis, including accelerated testing and solderability measurement, tailored training courses to meet client specifications
• Finite element modelling and virtual qualification
• Advice on legislation compliance and lead-free soldering

Resource

Microtechnology has a range of soldering assembly equipment including convection, infra-red, laser, themodes, irons and soldering pots. The Microtechnology's reliability suite added to TWI's electron microscopy suite and modelling capability can be used to improve assembly design or predict failure modes.

View our services in Reliability Testing.

If you require further information on soldering or if you want to discuss your application, please email to micro@twi.co.uk.