Technology file

Wire bonding

Expertise

Wedge bonds
Wire bonding

TWI's Microtechnology Section has been at the forefront of developments in wire bonding for over 30 years. Its R&D work and technical support for industry covers:

  • Aluminium, gold, copper and range of specialist wires
  • Ball/wedge, ball bumping, and wedge/wedge
  • 17µm - 500µm using standard capillaries and wedge tools
  • Down to 7µm using purpose built tools
  • Ultrasonic, thermosonic & thermocompression
  • Rigid, soft & compliant substrates

Equipment

Name of Equipment Comments
K&S 4124 manual ball bonder Ball bonding and bumping
K&S 4526 semi-automatic deep access wedge bonder 90° feed deep access wedge with loop bonding
K&S 4123 manual wedge bonder 45° feed wedge bonding
Orthodyne model 20 heavy wire bonder Up to 500µm wire
Dage BT100 materials tester Die shear testing
Dage series 4000 wire-pull/ ball-shear tester Multipurpose machine. Data analysis software.
Unitek micropull v wirebond pull tester MP5/230  
Hesse & Knipps BJ820 Automatic wedge bonder Gold and aluminium wire
High speed (production mode 7 wires per second)
Range of loop configurations possible
Touch down recognition (good for thin metallisations)
Precision wire deformation control for bond repeatability

Project Work

  • Prototyping, feasibility studies
  • Trouble shooting & failure analysis
  • Fatigue, mechanical & non destructive testing
  • Tailored & scheduled training courses
  • Environmental testing

For further information, please email your request to micro@twi.co.uk.

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