FacilitiesTWI's team of ceramic specialists - consisting of experienced professional scientists, engineers and technical staff - is backed up by extensive laboratory facilities and the total resources of TWI which is one of Europe's largest independent research and Technology organisations. Electrostatic bondingThe Electrostatic Bonding equipment was designed and built at TWI. The equipment incorporates cartridge heated Nimonic Platens which can be heated to 600°C and a pneumatic pressurising system enables the use of loads up to 7kN during bonding. Voltages up to a maximum 3kV can be applied across the components during the bonding sequence, with a maximum current of 30mA. Components up to 75mm in diameter can be bonded using this equipment.
Sputter coating
Substrates up to 100mm in diameter may be coated to a reasonable degree of uniformity with a variety of materials including; aluminium, chromium, copper, gold, nickel, silver, titanium and zirconium. Diffusion bonding/hot pressTWI has three diffusion-bonding presses, two radiant heated and the other using induction. The specifications for this equipment are summarised below.
DB5
DB6
DB7
Surface profilometrySurface measurement equipment capable of measuring surface profiles and roughness to an accuracy of 0.1mm. Vacuum brazing furnaces
VB1
VB2
Induction - in vacuum, with inert gas, or with fluxes, with a temperature capability of 1400°C;
Torch/Flame - various torches with different fuel/gas mixtures.
Air furnaces
AF1 and AF2
AF3
AF4
Tube furnaceTube diameter 70mm
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