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- Adhesive Bonding Technology at TWI - Course announcement
The Microtechnology and Reliability Centre at TWI specialises in joining and assembly project work for the electronics, photonics, sensor, medical and instrumentation industries. The purpose-built Centre near Cambridge, UK, spans a diversity of activities, and houses cleanrooms with a comprehensive array of electronics, microstructural and sensor packaging, assembly and testing facilities with state-of-the art microjoining, surfacing and machining equipment. TWI's expertise in the microtechnology industry has been developed over more than 40 years and a well-deserved international reputation has been built for applying established technologies and innovation to achieve best practice. Multidisciplinary teams work with Industrial Member companies helping them to optimise product performance by rapid response problem solving. All aspects of product life cycle are covered from design, through manufacturing, quality control and assessment, to disassembly and recycling. Working with some of the largest and most technically advanced companies, practical solutions are given for even the most difficult of problems such as harsh environments. Companies from around the world find answers rapidly at TWI.
