Key TWI staff involved with the electronics, photonics, sensors and medical industries

Norman Stockham is TWI's Electronics & Sensors Section Manager. He has over 20 years experience in microelectronic and sensor packaging covering a wide variety of process and assembly technology including: wire, ribbon, flip chip, TAB, die attach, encapsulants, package sealing, hybrid circuits, COB, MCM, SMT, display and optical packaging. He has lectured widely, in Europe, USA and the Far East, on the subjects of electronic packaging and joining technology and has published many papers in the technical press. He represents TWI on ITIC (Interconnection Technology Industrial Consortium), Editorial Panel of the International Material Reviews and the Journal of Electronics Manufacturing.

Mehdi Tavakoli gained a BSc in Chemistry and then received his MSc and PhD in Polymer Science and Technology at Aston University in Birmingham, England. His initial research work included polymer degradation and stability. Since joining TWI in 1989, Dr Tavakoli has been working on a number of novel joining and coating techniques. His current interests include use of adhesives and encapsulants in micro and optoelectronics with particular emphasis on adhesion, reliability, rapid curing and precision dispensing. He has over 20 years research, industrial problem solving and product development experience on polymeric materials and has published more than 35 papers and patents. He currently works as a Technology Manager at TWI.

Michele Routley Michèle Routley gained an MSci in Physics with Electronics from St Andrews University before a PhD in Microelectronics at the University of Southampton, investigating transistor fabrication technology. Michèle started at TWI in 2001 in the Microtechnology Section, focusing on reliability and life extension. Michèle now manages the Business Process Support Section at TWI and co-ordinates an advanced design centre to support one of TWI's member companies. Present interests include technology management, supply chains and environmental legislation.

Roger Wise is a physicist who joined TWI in 1986. He spent 4 years in the Electron Beam Welding Group, developing high power equipment, before joining the Polymer Joining Group. While researching ultrasonic welding of polymers he gained a PhD in Materials Science and wrote a book on welding polymers. Roger then became Engineering Director of a wireless telecoms antenna company for 3 years. He then returned to TWI and currently manages the Advanced Materials and Processes Technology Group, which comprises the Polymer, Ceramics and Microtechnology Sections

Ian Nicholson has over 15 years experience in microelectronics, sensor application and software development. He is currently a principal project scientist within the NDT group at TWI. His current research topics deal with non destructive testing methods for PCB inspection including digital radiography (X-ray) inspection, thermography, automated optical imaging and scanning acoustic microscopy. In addition he has experience in systems integration and automating NDT inspection.

For all enquiries on the Electronics and Sensors Industry, e-mail electronicsandsensors@twi.co.uk, and in the Medical Industry, medical@twi.co.uk

Other Key TWI personnel involved with the Electronics, Photonics, Sensors and Medical Industry Sector are:

	Chris Otter Electronic Packaging & Wire Bonding, Microjoining processes
	Simon Mason Soldering
	Mike Gittos Metallurgy/Failure Analysis
	Alan Taylor Sol-Gel/Glass
	Stuart Bond Corrosion
	Sue Dunkerton Director of the Health Technologies KTN Materials & Joining/Medical Polymers
	Ian Jones Lasers/Polymers/ClearWeld
	Ewen Kellar Adhesives & Encapsulants
	Alex Gunner Ceramics
	Simon Smith Finite Element Analysis
	Pete Tubby Fatigue/Sensors
	Steve Westgate Resistance Welding/Mechanical Fastenings
	Adrian Duncan UK/European Contracts
	Pete Oakley UK/European Contracts