Microtechnology
The Microtechnology section specialises in device assembly, packaging, interconnection and material joining at small dimensions.
Its activities cover the following industry sectors:
- Aerospace
- Automotive
- Medical
- Electronics
The Microtechnology Section has knowledge in the following technologies:
- Joining (Micro Friction stir, resistance, laser, adhesives, ultrasonic)
- Micro Laser machining
- Microelectronics
- Soldering
- Prototype Design
- Reliability
With its wide range of expertise, it can offer support at all stages of your production, from design to testing and validation. Its team can also offer tailored training on different processes. All client project work remains confidential.
- Key equipment in microtechnology
- Small Scale Laser Processes
- Electronic packaging
- Optoelectronics
- PCB Assembly and soldering
- Harsh environment packaging
If you would like to know more about the activities of the Microtechnology Section, please e-mail micro@twi.co.uk
Copyright ©2008 TWI Ltd
Information and advice from TWI and its partners are provided in good faith and based, where appropriate, on the best engineering knowledge available at the time and incorporated into TWI's website in accordance with TWI's ISO 9001:2000 accredited status. No warranty expressed or implied is given regarding the results or effects of applying information or advice obtained from the website, nor is any responsibility accepted for any consequential loss or damage.
