Cut cost, save time, predict failure in electronic components

At TWI, design and reliability engineers can now predict and combat the causes of failure in electronic components and assemblies. Causes of failures are linked to fundamental mechanisms associated with mechanical and thermal loading, chemical attack, radiation and corrosion.

Being able to predict the effect that these factors will have on performance is critical to designing cost effective, long-lasting electronic systems and products.

Analysis methods take account of the impact these operating conditions will have on new designs or can be used to investigate their relevance on existing designs.

Thermal and vibration analyses can be carried out as part of a full failure assessment using calcePWA software ( www.calce.umd.edu), which employs physics-of-failure methods to evaluate the lifetimes of electronic systems.

TWI's cross disciplinary approach combined with its testing capabilities in the area of electronics reliability, enable the evaluation and validation of predictions to be undertaken.

The benefits of this approach include:

  • Reduced time to market
  • An integrated design environment incorporating reliability assessment and life cycle costing into the earliest design stages
  • Potential to eliminate weak designs at an early stage of development
  • The use of physics of failure design principles
  • Realistic failure mode principles used
  • Delivery of designs that result in cost efficient and reliable electronic components, PWBs, and systems

Successful applications include

Military

  • Failure analysis on circuit cards
  • Design assessment and improvement
  • Estimated savings of over $30M

Automotive

  • 83% reduction in design issues
  • >15% reduction in time to market

Avionics/Space

  • Virtual qualifications of preliminary designs identifying reliability issues
    Early identification avoids considerable costs
  • Used to verify robustness of electronics in space applications

Consumer/Industrial Applications

  • Assisted in development of a suitable test
  • Identified design weaknesses
  • Improved product reliability

To find out more about how TWI's services can help you to understand, predict and manage causes of failure, contact:
electronicsandsensors@twi.co.uk Copyright © 2005 TWI Ltd

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