Technology file
Diffusion bonding
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- a solid state process requiring no filler material |
Copper heat exchanger produced by diffusion bonding a series of 1mm thick metal shims |
Expertise
TWI's Advanced Materials & Processes Department offers over 20 years' experience in uniaxial and isostatic diffusion bonding. Carried out at around 80% of the material's melting point and under a small load, copper, nickel alloy, stainless steel, titanium alloys, ODS alloys and ceramics have been successfully diffusion bonded at TWI.Resource
- a range of equipment provides:
- - uniaxial loading
- - hot isostatic pressing
- - induction heating
- - radiant heating (up to 1850°C)
- advice on process selection & quality issues
- feasibility studies & process development
- applications development & pre-production trials
- testing & evaluation facilities
All TWI's confidential consultancy and project work is conducted to ISO 9001 quality standard
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