Technology file
| Glob top dispensing to protect chip and wire bonds |
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Technology
Glob Top is a technique where a measured volume of specially formulated resin is deposited over a chip and its wire bonds. The resin provides mechanical support and excludes contaminants and residues, which could disrupt circuit operations by e.g. corrosion.
Expertise
Using its expertise in selection materials, dispense equipment and application-specific processing, the Microtechnology Section provides the following services:
- Troubleshooting and advice on best practice
- Guidance on selection of appropriate materials
- Technical support in pre- and post-glob top processing
- NDT analysis to support glob top processing
- Tailored training courses
Project Work
Project work and consultancy activities have included:
- Dispense, flow and cure characterisation studies
- Measurement of electrical properties
- Accelerated ageing tests
- Detection of moisture and its ingress in materials
- De-capsulation of glob top materials for failure analysis
If you require further information please email to micro@twi.co.uk.
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