Technology file
| Friction Acoustic Bonder |
 |
Friction Acoustic Bonding is a solid phase joining process, which uses a non-consumable rotating tool to generate heat and deformation in the materials to be bonded.
The bonding process is based on frictional heat but also includes pressure pulsing from a slightly eccentric rotating 'disc' type tool.
The modest heat generated by the process makes it attractive for joining applications where heat sensitive components are present.
Expertise
The Microtechnology Section has expertise in Friction acoustic bonding and has demonstrated the following applications for this process:
- seam welding of aluminium & copper (from 0.1mm thick up to 3mm thick) for heat sink manufacture
- Bonding Aluminium to Alumina
- joining copper wires to connectors, terminals and PCB metallisation
- joining copper wires without prior insulation removal
Resource
- Bespoke FAB equipment for feasibility studies & process development
- background knowledge of FAB process & its capabilities
- metallurgical support services
- wide range of joint testing & analysis facilities
If you require further information or if you want to discuss your application, please email to micro@twi.co.uk.
Copyright © 2008 TWI Ltd
Information and advice from TWI and its partners are provided in good faith and based, where
appropriate, on the best engineering knowledge available at the time and incorporated into TWI's
website in accordance with TWI's ISO 9001:2000 accredited status. No warranty expressed or implied
is given regarding the results or effects of applying information or advice obtained from the
website, nor is any responsibility accepted for any consequential loss or damage.