In partnership with Hesse & Knipps GmbH and Accelonix Ltd, TWI is pleased to announce that our clean room facilities have been have been boosted by the installation of a new automatic wedge bonder which is available for wirebonding development projects.
The latest Hesse & Knipps fully automatic wedge bonder, the BONDJET 820, has been installed and commissioned to complement the existing chip and package level processing capabilities, including K&S semi-automatic wirebonders, FineTech flip-chip bonder, Cammax die attach and Dage testing facilities in our clean room.
The BJ820 features several improvements on previous models and also introduces an innovative bond head design which uses piezo-electric actuators. This development has resulted in fast, precise programmable wire clamping parameterssuch as tail length, tear off and gap opening with the added benefits of a wear and maintenance free system.
Other key features of the BJ820 include:
- Large work area - 305 mm x 410 mm (12.3" x 16.14")
- High bonding speeds - up to 7 wires/second
- Improved bond head design - fewer moving parts make extremely low maintenance - simplified construction is more consistent and robust
- 12.5 to 80µm wire diameter capability
- Interchangeable 90° deep access and 45° wire feed bond heads. (60° wire feed bond head available soon)
- Continuous monitoring of wire deformation and transducer current within programmable upper and lower control limits
- Improved programming interface
- Ribbon bonding capability
- Very fine pitch capability - 40µm and below (dependent on tool design and wire diameter)
The bonder benefits from a large working envelope and comes with a large heated vacuum work table. The table is easily interchanged with custom-built replacements to suit your application.
Whilst the BJ820 is designed as a high speed, high throughput machine, the degree of positional accuracy and axis repeatability (±1µm at 3 σ) also make it very good for one-off sample production, process development, prototyping volumes and research projects.
TWI can run prototype batches of your wedge bonding application using the Hesse & Knipps BJ820 bonder as part of your feasibility trials, product development or prototyping requirements. Demonstrations of the wire bonder'scapabilities can also be arranged.
For further information on TWI's wire bonding and associated assembly technologies contact: Chris Otter chris.otter@twi.co.uk or Helen Goddin helen.goddin@twi.co.uk.
