Ball Wedge Bonding Hughes Machine

A ball is formed at the tip of a wire projecting from a capillary. The capillary is positioned above an interconnection and a bump is formed on the interconnection by ball bonding. The capillary is moved next to the bump and wedge bonding is conducted which severs the wire leaving a bump behind. Primary bonding to the bonding pad of a semiconductor is then carried out and the wire from this joint is looped to the first bump where secondary bonding of the wire to the bump is carried out.&. For more information, please contact us.