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Microjoining
Electronics and Photonics Assembly
Circuit board assembly
Wire bonding
Flip chip bonding
System in Package (SiP) and Integrated Passives
Glob top
Real-time microfocus X-ray inspection
Photonics KTN
Thermal management
Reliability services
Reliability
Precision reliability testing
Environmental testing
Soldering
Small scale laser processes
Small scale friction processes
Micro friction welding
Micro friction stir welding
Friction Acoustic Bonding
Small scale resistance welding
Ultrasonic bonding
Prototype and project services
Design activities at TWI
Collaborative project management
