TWI Frequently asked questions
by Simon Mason
Below is a range of commonly used acronyms in the electronics industry, and what they stand for:
| ACA | Anisotropic Conductive Adhesive |
| ACF | Anisotropic Conductive Film |
| AOI | Automated Optical Inspection |
| ASIC | Application Specific Integrated Circuit |
| ATE | Automated Test Equipment |
| BGA | Ball Grid Array |
| CAD | Computer Aided Design |
| CCD | Charge Coupled Device |
| CEM | Contract Electronics Manufacturer |
| CMOS | Complementary Metal Oxide Semiconductor |
| COB | Chip On Board |
| COF | Chip On Flex |
| COG | Chip On Glass |
| CSP | Chip Scale Package |
| CTE | Coefficient of Thermal Expansion |
| DCA | Direct Chip Attach |
| DIP | Dual In-line Package |
| EMC | Electromagnetic Compatibility |
| EMI | Electromagnetic Interference |
| ENIG | Electroless Nickel/Immersion Gold |
| EPROM | Electrically Programmable Read Only Memory |
| ESD | Electrostatic Discharge |
| FPT | Fine Pitch Technology |
| HASL | Hot Air Solder Levelled |
| HDI | High Density Interconnect |
| ICT | In Circuit Test |
| IPC | Institute of Interconnecting and Packaging Electronic Circuits |
| IPD | Integrated Passive Device |
| ISO | International Organisation of Standards |
| MCM | Multi Chip Module |
| MELF | Metal Electrode Leadless Face |
| OSP | Organic Solderability Protective |
| PLCC | Plastic Leaded Chip Carrier |
| PTH | Plated Through Hole |
| QFP | Quad Flat Pack |
| SIP | System In a Package |
| SIR | Surface Insulation Resistance |
| SMT | Surface Mount Technology |
| SOC | System On a Chip |
| SOIC | Small Outline Integrated Circuit |
| SOP | Small Outline Package |
| SOT | Small Outline Transistor |
| SPC | Statistical Process Control |
| TSOP | Thin Small Outline Package |
